Invention Grant
- Patent Title: Embedded resilient buffer
- Patent Title (中): 嵌入式弹性缓冲区
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Application No.: US13867968Application Date: 2013-04-22
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Publication No.: US09337952B2Publication Date: 2016-05-10
- Inventor: Somnath Paul , Sriram R. Vangal
- Applicant: Somnath Paul , Sriram R. Vangal
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H04L1/00
- IPC: H04L1/00 ; H03K19/00 ; G06F11/26 ; G11C29/00 ; G11C29/02 ; G06F13/16 ; H04L12/70

Abstract:
Described is an apparatus that comprises: a first sequential unit; a first queue coupled in parallel to the first sequential unit such that the first queue and first sequential unit receive a first input, the first sequential for double sampling the first input; a compare unit to receive an output from the first sequential unit; and a first selection unit controllable by a write pointer of a previous cycle, the first selection unit to receive outputs of each storage unit of the first queue, wherein the first selection unit to generate an output for comparison by the first compare unit.
Public/Granted literature
- US20140317458A1 EMBEDDED RESILIENT BUFFER Public/Granted day:2014-10-23
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