An automation device configured for an automation environment and for automating an industrial process includes a first printed circuit board, a second printed circuit board, a first electronic component arranged on the first printed circuit board and a second electronic component arranged on the second printed circuit board, a heatsink arranged on the first printed circuit board, wherein the first electronic component is arranged between the first printed circuit board and the heatsink, the heatsink has a cuboid shape and rests on the first electronic component with a first cooling contact surface incorporated in a first lateral surface of the cuboid and a second cooling contact surface incorporated in a second lateral surface of the heatsink rests on the second electronic component, and the second printed circuit board is arranged essentially vertically with respect to the first printed circuit board.