Invention Grant
- Patent Title: Laminated body and manufacturing process therefor
- Patent Title (中): 层压体及其制造工艺
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Application No.: US14237408Application Date: 2012-08-08
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Publication No.: US09338884B2Publication Date: 2016-05-10
- Inventor: Koutarou Arai , Yasuhiro Seta , Kazuyuki Ogawa
- Applicant: Koutarou Arai , Yasuhiro Seta , Kazuyuki Ogawa
- Applicant Address: JP Tokyo
- Assignee: Nippon Soda Co., Ltd.
- Current Assignee: Nippon Soda Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2011-175149 20110810
- International Application: PCT/JP2012/070221 WO 20120808
- International Announcement: WO2013/022032 WO 20130214
- Main IPC: H05K1/09
- IPC: H05K1/09 ; C23C18/12

Abstract:
Disclosed is a laminated body including a substrate having an unevenness with an aspect ratio of 1.5 to 100 in the surface thereof, and a conductive film that is laminated in an approximately uniform thickness on a bottom, side wall surfaces, and an apex of the unevenness, the conductive film being any one film selected from the group consisting of an ITO film, an FTO film, a SnO2 film, an ATO film, an AZO film, a GZO film, an IZO film, and an IGZO film.
Public/Granted literature
- US20140251666A1 LAMINATED BODY AND MANUFACTURING PROCESS THEREFOR Public/Granted day:2014-09-11
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