Invention Grant
- Patent Title: Method and apparatus for assembling electric components on a flexible substrate as well as assembly of an electric component with a flexible substrate
- Patent Title (中): 用于在柔性基板上组装电气部件的方法和装置以及具有柔性基板的电气部件的组装
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Application No.: US13990823Application Date: 2011-12-02
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Publication No.: US09338894B2Publication Date: 2016-05-10
- Inventor: Jeroen Van Den Brand , Roel Henry Louis Kusters , Andreas Heinrich Dietzel
- Applicant: Jeroen Van Den Brand , Roel Henry Louis Kusters , Andreas Heinrich Dietzel
- Applicant Address: NL Delft
- Assignee: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Current Assignee: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Current Assignee Address: NL Delft
- Agency: Banner & Witcoff, Ltd.
- Priority: EP10193724 20101203
- International Application: PCT/NL2011/050830 WO 20111202
- International Announcement: WO2012/074405 WO 20120607
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K3/30 ; H05K3/32 ; H01L23/498 ; H01L23/00 ; H05K1/18 ; H05K1/02 ; H05K3/12

Abstract:
A method is presented for assembling a component (30) with a flexible substrate (10), the component having electric contacts (31). The method comprises the steps of placing the component (30) on a first main side (11) of the substrate, applying a machine vision step to estimate a position of the electric contacts, depositing one or more layers (32) of an electrically conductive material or a precursor thereof, said layer extending over an area of the substrate defined by the component to laterally beyond said area, calculating partitioning lines depending on the estimated position of the electric contacts, partitioning the layer into mutually insulated areas (32d) by locally removing material from said layer along said partitioning lines. Also an apparatus is presented that is suitable for carrying out the method.In addition an assembly is present that can be obtained by the method and the apparatus according to the invention.
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