Invention Grant
- Patent Title: Optical module, manufacturing method of optical module and optical communication device
- Patent Title (中): 光模块，光模块和光通信设备的制造方法
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Application No.: US13414883Application Date: 2012-03-08
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Publication No.: US09341791B2Publication Date: 2016-05-17
- Inventor: Tsuyoshi Ogawa , Kazuyoshi Yamada , Takashi Mizoroki
- Applicant: Tsuyoshi Ogawa , Kazuyoshi Yamada , Takashi Mizoroki
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Hazuki International, LLC
- Priority: JP2011-085707 20110407
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/42
Abstract:
An optical module includes: a substrate provided with a through hole for inserting an optical fiber from a second principal surface side of the substrate; an optical device provided on a first principal surface side of the substrate; a first electrode provided in the substrate for connecting an electric fiber from the second principal surface side; a second electrode formed on the first principal surface side of the substrate for connecting to the optical device; and a third electrode provided on a side surface of the substrate and electrically connected to the second electrode.
Public/Granted literature
- US20120257852A1 OPTICAL MODULE, MANUFACTURING METHOD OF OPTICAL MODULE AND OPTICAL COMMUNICATION DEVICE Public/Granted day:2012-10-11
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