Invention Grant
US09343381B2 Semiconductor component with integrated crack sensor and method for detecting a crack in a semiconductor component
有权
具有集成裂纹传感器的半导体部件和用于检测半导体部件中的裂纹的方法
- Patent Title: Semiconductor component with integrated crack sensor and method for detecting a crack in a semiconductor component
- Patent Title (中): 具有集成裂纹传感器的半导体部件和用于检测半导体部件中的裂纹的方法
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Application No.: US13899906Application Date: 2013-05-22
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Publication No.: US09343381B2Publication Date: 2016-05-17
- Inventor: Markus Zundel , Uwe Schmalzbauer , Rudolf Zelsacher
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neibiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neibiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L21/66 ; H01L23/00
Abstract:
A first embodiment relates to a semiconductor component. The semiconductor component has a semiconductor body with a bottom side and a top side spaced distant from the bottom side in a vertical direction. In the vertical direction, the semiconductor body has a certain thickness. The semiconductor component further has a crack sensor configured to detect a crack in the semiconductor body. The crack sensor extends into the semiconductor body. A distance between the crack sensor and the bottom side is less than the thickness of the semiconductor body.
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Information query
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