Invention Grant
- Patent Title: Patch preparation
- Patent Title (中): 补丁准备
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Application No.: US13951697Application Date: 2013-07-26
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Publication No.: US09345670B2Publication Date: 2016-05-24
- Inventor: Tomohito Takita , Masahiro Mitsushima , Hidetoshi Kuroda , Yuji Saeki
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2012-191409 20120831
- Main IPC: A61K9/70
- IPC: A61K9/70 ; A61F13/02

Abstract:
The present invention provides a patch preparation that has an extremely low moisture permeability, has a sufficient ODT effect, is excellent in drug releasability, and has a preferred handleability. The patch preparation of the present invention includes a support; and a pressure-sensitive adhesive layer containing an adherent polymer and a drug on one surface of the support, wherein: the support has a polyester base layer, an inorganic oxide layer, and a polyester nonwoven fabric layer in the stated order; the polyester base layer has a thickness of 1.0 μm to 16 μm; and the pressure-sensitive adhesive layer is laminated on the polyester base layer.
Public/Granted literature
- US20140066865A1 PATCH PREPARATION Public/Granted day:2014-03-06
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