Invention Grant
- Patent Title: Honeycomb structure
- Patent Title (中): 蜂窝结构
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Application No.: US13611435Application Date: 2012-09-12
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Publication No.: US09346003B2Publication Date: 2016-05-24
- Inventor: Hiroyuki Suenobu , Koichi Sendo , Takahiko Nakatani , Takaya Yamaguchi
- Applicant: Hiroyuki Suenobu , Koichi Sendo , Takahiko Nakatani , Takaya Yamaguchi
- Applicant Address: JP Nagoya
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Burr & Brown, PLLC
- Priority: JP2012-163999 20120724
- Main IPC: B01D46/24
- IPC: B01D46/24

Abstract:
There is provided a honeycomb structure 100 comprising partition walls 1 separating and forming a plurality of cells 2 functioning as fluid passages. The partition walls 1 are made of cordierite, and, when an average pore size of the partition walls 1 is x (μm) while a porosity of the partition walls 1 is y (%), a relation of x and y is y≦−8.33x+86.66 and satisfies 0.5≦x≦5 and 35≦y≦70. The honeycomb structure 100 can improve thermal shock resistance without sacrificing any of light-off performance, catalyst coatability, and strength.
Public/Granted literature
- US20130071608A1 HONEYCOMB STRUCTURE Public/Granted day:2013-03-21
Information query
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