Invention Grant
US09346126B2 Laser processing head, laser processing apparatus, optical system of laser processing apparatus, laser processing method, and laser focusing method
有权
激光加工头,激光加工装置,激光加工装置的光学系统,激光加工方法和激光聚焦方法
- Patent Title: Laser processing head, laser processing apparatus, optical system of laser processing apparatus, laser processing method, and laser focusing method
- Patent Title (中): 激光加工头,激光加工装置,激光加工装置的光学系统,激光加工方法和激光聚焦方法
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Application No.: US13982790Application Date: 2011-05-30
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Publication No.: US09346126B2Publication Date: 2016-05-24
- Inventor: Masao Watanabe , Shuho Tsubota
- Applicant: Masao Watanabe , Shuho Tsubota
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- International Application: PCT/JP2011/062391 WO 20110530
- International Announcement: WO2012/164663 WO 20121206
- Main IPC: B23K26/06
- IPC: B23K26/06 ; B23K26/073 ; B23K26/38 ; G02B27/40

Abstract:
A laser cutting apparatus (10) includes a laser processing head (15) that receives a laser beam emitted by a laser oscillator (12) and that uses a spherical lens for converging the laser beam so as to cause the intensity distribution of the laser beam to have a caldera-like shape, in which the intensity of the laser beam is higher in a peripheral area than in a central area, at the position of a workpiece (20). Moreover, the laser processing head (15) radiates the laser beam whose focal position is displaced from the position of the workpiece (20) to the workpiece (20). Therefore, the laser cutting apparatus (10) performs an inversion on the laser beam by using the spherical aberration of the spherical lens. Consequently, with a simple configuration, a laser beam whose inner area and outer area are inverted at the position of the workpiece (2) can be generated, and the processing direction for processing the workpiece (20) is not limited.
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