Invention Grant
- Patent Title: Method for manufacturing flexible substrate with surface structure copying from a template
- Patent Title (中): 从模板制造表面结构复制的柔性基板的方法
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Application No.: US13481857Application Date: 2012-05-27
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Publication No.: US09346196B2Publication Date: 2016-05-24
- Inventor: Si-Chen Lee , Chieh-Hung Yang , Chun-Yuan Hsueh
- Applicant: Si-Chen Lee , Chieh-Hung Yang , Chun-Yuan Hsueh
- Applicant Address: TW Taipei
- Assignee: NATIONAL TAIWAN UNIVERSITY
- Current Assignee: NATIONAL TAIWAN UNIVERSITY
- Current Assignee Address: TW Taipei
- Agency: Li & Cai Intellectual Property (USA) Office
- Priority: TW100127988A 20110805
- Main IPC: B29C41/00
- IPC: B29C41/00 ; B29C41/36 ; B29C33/42 ; B29C41/38

Abstract:
Disclosed herein are a flexible substrate with surface structure and a method for manufacturing the flexible substrate. The disclosure relates to a low-cost process to manufacturing the flexible substrate that is adapted to the large-area mass production. According to one of the embodiments in the disclosure, the method introduces a mold with surface structure. An isolation material is formed on the mold surface in an earlier stage. Upon the isolation layer, a flexible substrate material is coated. After that, a baking step is employed to cure the flexible substrate material. The flexible substrate with surface structure is therefore formed after de-molding the cured substrate. Another aspect to the disclosure adopts the above-formed substrate to be a base substrate. A second flexible substrate with the surface structure identical to the mold is then formed by performing the above steps.
Public/Granted literature
- US20130034698A1 METHOD FOR MANUFACTURING FLEXIBLE SUBSTRATE WITH SURFACE STRUCTURE COPYING FROM A TEMPLATE Public/Granted day:2013-02-07
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