Invention Grant
- Patent Title: Flow path structure, liquid ejecting head, and liquid ejecting apparatus
- Patent Title (中): 流路结构,液体喷射头和液体喷射装置
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Application No.: US14638739Application Date: 2015-03-04
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Publication No.: US09346269B2Publication Date: 2016-05-24
- Inventor: Fujio Akahane , Isamu Togashi , Hiroaki Okui , Yasuyuki Kudo
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2014-053757 20140317; JP2014-053758 20140317
- Main IPC: B41J2/14
- IPC: B41J2/14

Abstract:
A flow path structure includes: a substrate that includes a first surface and a second surface on a side opposite to the first surface; a supply port formed on the first surface; a plurality of discharge ports formed on the second surface; grooves that are formed on the first surface so as to extend in an X direction and communicate with the supply ports and with the plurality of discharge ports via through-holes formed on the substrate; and a sealing portion that is disposed on the first surface and seals each groove.
Public/Granted literature
- US20150258786A1 FLOW PATH STRUCTURE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APPARATUS Public/Granted day:2015-09-17
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