A sheet processing device conveys a paper sheet onto which an adhesive is applied, and includes a bonding member that applies adhesives onto the conveyed paper sheet at intervals in a sheet width direction; and a protruding guide that is positioned on a conveying path, downstream of the bonding member in a sheet conveying direction, and guides the paper sheet, facing an adhesive-applied surface of the paper sheet. The protruding guide is positioned between sheet width direction lines of the adhesive-applied position and includes a protruding portion protruding into the conveying path. With this configuration, it is possible to suppress the adhesive from being adhered to a device component even in a configuration in which an adhesive-applied paper sheet is moved inside the device to make a sheet jam due to the adhesion less likely to occur.