Invention Grant
- Patent Title: Shielding MEMS structures during wafer dicing
- Patent Title (中): 晶圆切割期间屏蔽MEMS结构
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Application No.: US14172479Application Date: 2014-02-04
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Publication No.: US09346671B2Publication Date: 2016-05-24
- Inventor: Alan J. Magnus , Chad S. Dawson , Stephen R. Hooper
- Applicant: FREESCALE SEMICONDUCTOR, INC.
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agent Charlene R. Jacobsen
- Main IPC: B81B7/00
- IPC: B81B7/00 ; B81C1/00 ; H01L21/683
Abstract:
A MEMS wafer (46) includes a front side (52) having a plurality of MEMS structure sites (60) at which MEMS structures (50) are located. A method (40) for protecting the MEMS structures (50) includes applying (44) a non-active feature (66) on the front side of the MEMS wafer in a region that is devoid of the MEMS structures and mounting (76) the front side of the MEMS wafer in a dicing frame (86) such that a back side (74) of the MEMS wafer is exposed. The MEMS wafer is then diced (102) from the back side into a plurality of MEMS dies (48).
Public/Granted literature
- US20150217998A1 SHIELDING MEMS STRUCTURES DURING WAFER DICING Public/Granted day:2015-08-06
Information query
