Invention Grant
- Patent Title: Abrasive, abrasive set, and method for abrading substrate
- Patent Title (中): 研磨剂，研磨剂组合物和研磨基材的方法
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Application No.: US14379947Application Date: 2013-02-14
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Publication No.: US09346977B2Publication Date: 2016-05-24
- Inventor: Hisataka Minami , Toshiaki Akutsu , Tomohiro Iwano , Koji Fujisaki
- Applicant: HITACHI CHEMICAL COMPANY, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin and Flannery LLP
- Priority: JP2012-035439 20120221
- International Application: PCT/JP2013/053558 WO 20130214
- International Announcement: WO2013/125445 WO 20130829
- Main IPC: C09K13/00
- IPC: C09K13/00 ; C09G1/02 ; H01L21/3105 ; C09K3/14 ; H01L21/306 ; H01L21/762
Abstract:
The polishing agent of the invention comprises water, an abrasive grain containing a hydroxide of a tetravalent metal element, and a specific glycerin compound.
Public/Granted literature
- US20150024596A1 ABRASIVE, ABRASIVE SET, AND METHOD FOR ABRADING SUBSTRATE Public/Granted day:2015-01-22
Information query
