Invention Grant
US09346990B2 Temporary adhesive material for wafer processing, wafer processing laminate, and method for manufacturing thin wafer using same
有权
用于晶片加工的临时粘合材料,晶片加工层压板,以及使用其制造薄晶片的方法
- Patent Title: Temporary adhesive material for wafer processing, wafer processing laminate, and method for manufacturing thin wafer using same
- Patent Title (中): 用于晶片加工的临时粘合材料,晶片加工层压板,以及使用其制造薄晶片的方法
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Application No.: US14720223Application Date: 2015-05-22
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Publication No.: US09346990B2Publication Date: 2016-05-24
- Inventor: Hiroyuki Yasuda , Michihiro Sugo
- Applicant: SHIN-ETSU CHEMICAL CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2014-119579 20140610
- Main IPC: H01L21/304
- IPC: H01L21/304 ; H01L21/683 ; C09J183/14 ; C09J153/00 ; C09J5/04 ; C09J5/06 ; C09J7/00 ; C09J125/08 ; C09J183/10 ; H01L21/18

Abstract:
The invention is adhesive material for a wafer processing used for temporarily bonding a supporting substrate to wafer having a front surface includes circuit formed thereon and a back surface to be processed, including first temporary adhesive layer composed of a layer of a silicone-modified styrene base thermoplastic elastomer, and second temporary adhesive layer composed of a thermosetting polymer layer on first temporary adhesive layer, wherein layer is capable of releasably adhering to front surface of wafer, and layer is capable of releasably adhering to the supporting substrate. Thereby, it provides a temporary adhesive material for wafer processing, wafer processing lamination, and method for manufacturing thin wafer using same, which facilitates temporary adhesion between supporting substrate and wafer having a circuit, is highly compatible with steps of forming TSV and forming wiring on back surface of wafer, allows easy delamination, and is capable of increasing productivity of thin wafers.
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