Invention Grant
- Patent Title: Method of plating stainless steel and plated material
- Patent Title (中): 电镀不锈钢和电镀材料的方法
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Application No.: US13699489Application Date: 2011-05-23
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Publication No.: US09347145B2Publication Date: 2016-05-24
- Inventor: Takeshi Bessho
- Applicant: Takeshi Bessho
- Applicant Address: JP Aichi
- Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee Address: JP Aichi
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-118208 20100524
- International Application: PCT/IB2011/001098 WO 20110523
- International Announcement: WO2011/148242 WO 20111201
- Main IPC: C25D5/10
- IPC: C25D5/10 ; C25D5/50 ; C23C28/02 ; C25D5/14 ; C25D5/34 ; C25D5/36 ; C25D7/00

Abstract:
The method of plating a stainless steel substrate including depositing a first plating metal layer over the stainless steel substrate), forming an interdiffusion layer in which elements of the stainless steel substrate and elements of the first plating metal layer interdiffuse, by applying a heat treatment to the stainless steel substrate coated by the first plating metal layer, and coating a second plating metal layer over the surface of the stainless steel substrate over which the interdiffusion layer is coated.
Public/Granted literature
- US20130071688A1 METHOD OF PLATING STAINLESS STEEL AND PLATED MATERIAL Public/Granted day:2013-03-21
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