Invention Grant
- Patent Title: Hot water supply apparatus associated with heat pump
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Application No.: US14329133Application Date: 2014-07-11
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Publication No.: US09347683B2Publication Date: 2016-05-24
- Inventor: Jieseop Sim
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG Electronics Inc.
- Current Assignee: LG Electronics Inc.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates LLP
- Priority: KR10-2010-0047300 20100520
- Main IPC: F25B7/00
- IPC: F25B7/00 ; F24H4/02 ; F24D11/02 ; F24D17/02

Abstract:
A hot water supply apparatus associated with a heat pump is provided. The hot water supply apparatus performs a hot water supply operation using a high temperature refrigerant that has been discharged from a compressor, and simultaneously performs an indoor heating operation using a two-stage refrigerant cycle. This allows the apparatus to supply hot water while simultaneously providing heating/cooling to an indoor space.
Public/Granted literature
- US20140326011A1 HOT WATER SUPPLY APPARATUS ASSOCIATED WITH HEAT PUMP Public/Granted day:2014-11-06
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