Invention Grant
- Patent Title: Chip arrangement and method of manufacturing the same
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Application No.: US14147547Application Date: 2014-01-05
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Publication No.: US09349680B2Publication Date: 2016-05-24
- Inventor: Joachim Mahler , Peter Strobel , Edward Fuergut
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00 ; H01L23/31 ; H01L23/538 ; H01L21/56
Abstract:
A chip arrangement is provided which comprises a carrier; and at least two chips arranged over the carrier; wherein a continuous insulating layer is arranged between the at least two chips and between the carrier and at least one of the at least two chips.
Public/Granted literature
- US20150194377A1 Chip arrangement and method of manufacturing the same Public/Granted day:2015-07-09
Information query
IPC分类:
