Invention Grant
- Patent Title: Semiconductor structure with airgap
- Patent Title (中): 具有气隙的半导体结构
-
Application No.: US14480215Application Date: 2014-09-08
-
Publication No.: US09349793B2Publication Date: 2016-05-24
- Inventor: Mark D. Jaffe , Alvin J. Joseph , Qizhi Liu , Anthony K. Stamper
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Steven Meyers; Andrew M. Calderon
- Main IPC: H01L21/306
- IPC: H01L21/306 ; H01L29/06 ; H01L29/78 ; H01L29/66 ; H01L21/265 ; H01L21/764 ; H01L21/762 ; H01L21/02

Abstract:
A field effect transistor (FET) with an underlying airgap and methods of manufacture are disclosed. The method includes forming an amorphous layer at a predetermined depth of a substrate. The method further includes forming an airgap in the substrate under the amorphous layer. The method further includes forming a completely isolated transistor in an active region of the substrate, above the amorphous layer and the airgap.
Public/Granted literature
- US20160071925A1 SEMICONDUCTOR STRUCTURE WITH AIRGAP Public/Granted day:2016-03-10
Information query
IPC分类: