Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14045925Application Date: 2013-10-04
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Publication No.: US09349854B2Publication Date: 2016-05-24
- Inventor: Markus Zundel , Peter Brandl
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L29/78 ; H01L29/10 ; H01L29/66 ; H01L29/40 ; H01L29/423 ; H01L29/08 ; H01L29/06

Abstract:
A semiconductor device includes a vertical IGFET in a first area of a semiconductor body, the vertical IGFET having a drift zone between a body zone and a drain electrode, the drift zone having a vertical dopant profile of a first conductivity type being a superposition of a first dopant profile declining with increasing distance from the drain electrode and dominating the vertical dopant profile in a first zone next to the drain electrode and a second dopant profile being a broadened peak dopant profile and dominating the vertical dopant profile in a second zone next to the body zone.
Public/Granted literature
- US20150097233A1 Semiconductor Device and Method of Manufacturing the Same Public/Granted day:2015-04-09
Information query
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