Invention Grant
- Patent Title: Top metal pads as local interconnectors of vertical transistors
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Application No.: US14608958Application Date: 2015-01-29
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Publication No.: US09349859B1Publication Date: 2016-05-24
- Inventor: Wai-Yi Lien , Yi-Hsun Chiu , Jia-Chuan You , Yu-Xuan Huang , Chih-Hao Wang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L27/092 ; H01L21/8238 ; H01L23/535 ; H01L29/786

Abstract:
An integrated circuit structure includes a first vertical transistor and a second vertical transistor. The first vertical transistor includes a first semiconductor channel, a first top source/drain region over the first semiconductor channel, and a first top source/drain pad overlapping the first top source/drain region. The second vertical transistor includes a second semiconductor channel, a second top source/drain region over the second semiconductor channel, and a second top source/drain pad overlapping the second top source/drain region. A local interconnector interconnects the first top source/drain pad and the second top source/drain pad. The first top source/drain pad, the second top source/drain pad, and the local interconnector are portions of a continuous region, with no distinguishable interfaces between the first top source/drain pad, the second top source/drain pad, and the local interconnector.
Information query
IPC分类: