Invention Grant
- Patent Title: Systems and methods for stacking compression connectors
- Patent Title (中): 用于堆叠压缩连接器的系统和方法
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Application No.: US14467807Application Date: 2014-08-25
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Publication No.: US09350098B2Publication Date: 2016-05-24
- Inventor: Sandor Farkas , Corey Dean Hartman , Brandon Joel Brocklesby , Joseph Tarantolo
- Applicant: Dell Products L.P.
- Applicant Address: US TX Round Rock
- Assignee: Dell Products L.P.
- Current Assignee: Dell Products L.P.
- Current Assignee Address: US TX Round Rock
- Agency: Jackson Walker L.L.P.
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H05K1/00 ; H01R12/71 ; H01R12/70 ; H01R43/00

Abstract:
In accordance with embodiments of the present disclosure, a circuit board comprising may include a substrate, a primary compression connector, and a second compression connector. The substrate may have a first side and a second side and may have formed therein a substrate retention channel. The primary compression connector may be coupled to the first side and have formed thereon a primary connector retention channel aligned with the substrate retention channel. The second compression connector may be coupled to the second side opposite from the first compression connector and may have formed thereon a secondary connector retention channel aligned with the substrate retention channel and the primary connector retention channel to define a circuit board retention channel.
Public/Granted literature
- US20160056560A1 SYSTEMS AND METHODS FOR STACKING COMPRESSION CONNECTORS Public/Granted day:2016-02-25
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