Invention Grant
- Patent Title: Electronic/electrical connecting arrangement
- Patent Title (中): 电子/电气连接装置
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Application No.: US14404653Application Date: 2013-04-13
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Publication No.: US09350129B2Publication Date: 2016-05-24
- Inventor: Jochen Heimsch
- Applicant: H & B Electronic GmbH & Co. KG
- Applicant Address: DE Deckenpfronn
- Assignee: H & B ELECTRONIC GMBH & CO. KG
- Current Assignee: H & B ELECTRONIC GMBH & CO. KG
- Current Assignee Address: DE Deckenpfronn
- Agency: Browdy and Neimark, PLLC
- Priority: DE202012005335U 20120531
- International Application: PCT/EP2013/001090 WO 20130413
- International Announcement: WO2013/178309 WO 20131205
- Main IPC: H01R31/06
- IPC: H01R31/06 ; H01R4/24 ; H01R43/20 ; H01R43/26

Abstract:
The invention relates to an electronic/electrical connecting arrangement (2) with a first housing part (28) and a second housing part (30), which can be brought along an assembly axis (M1) into a connecting position in which they form a first connection contour (41), which is connectable to the first contacting element (4), and a second connection contour (50). A connecting conductor (22) is received in the housing of the connecting element (8), the connecting conductor having first contacting means (24) on the first connection contour (41) that can be brought into electrical/electronic contact with the first conductor (10) in a first contact plane (KE1), and second contacting means (26) on the second connection contour (50) that can be brought into electrical/electronic contact with the second conductor (20) in a second contact plane (KE2) different from the first contact plane (KE1).
Public/Granted literature
- US20150303631A1 ELECTRONIC/ELECTRICAL CONNECTING ARRANGEMENT Public/Granted day:2015-10-22
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