Invention Grant
US09350339B2 Systems and methods for clock distribution in a die-to-die interface
有权
芯片到芯片接口中时钟分配的系统和方法
- Patent Title: Systems and methods for clock distribution in a die-to-die interface
- Patent Title (中): 芯片到芯片接口中时钟分配的系统和方法
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Application No.: US14335681Application Date: 2014-07-18
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Publication No.: US09350339B2Publication Date: 2016-05-24
- Inventor: Thomas Clark Bryan , Alvin Leng Sun Loke , Stephen Knol , Gregory Francis Lynch , Tin Tin Wee , LuVerne Ray Peterson , Yue Li
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Haynes and Boone, LLP
- Main IPC: H03K3/00
- IPC: H03K3/00 ; H03K5/15 ; H01L23/538 ; G06F1/10 ; G11C7/22 ; H01L25/065

Abstract:
Circuits for die-to-die clock distribution are provided. A system includes a transmit clock tree on a first die and a receive clock tree on a second die. The transmit clock tree and the receive clock tree are the same, or very nearly the same, so that the insertion delay for a given bit on the transmit clock tree is the same as an insertion delay for a bit corresponding to the given bit on the receive clock tree. While there may be clock skew from bit-to-bit within the same clock tree, corresponding bits on the different die experience the same clock insertion delays.
Public/Granted literature
- US20160020759A1 SYSTEMS AND METHODS FOR CLOCK DISTRIBUTION IN A DIE-TO-DIE INTERFACE Public/Granted day:2016-01-21
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