Invention Grant
- Patent Title: Encapsulant module with opaque coating
- Patent Title (中): 具有不透明涂层的封装模块
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Application No.: US12465092Application Date: 2009-05-13
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Publication No.: US09350906B2Publication Date: 2016-05-24
- Inventor: Shin-Chang Shiung , Chieh-Yuan Cheng , San-Yuan Chung
- Applicant: Shin-Chang Shiung , Chieh-Yuan Cheng , San-Yuan Chung
- Applicant Address: US CA Santa Clara TW Hsinchu
- Assignee: OMNIVISION TECHNOLOGIES, INC.,VISERA TECHNOLOGIES COMPANY LIMITED
- Current Assignee: OMNIVISION TECHNOLOGIES, INC.,VISERA TECHNOLOGIES COMPANY LIMITED
- Current Assignee Address: US CA Santa Clara TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H04N5/225
- IPC: H04N5/225 ; G03B19/00
Abstract:
The invention provides an encapsulant module for an image sensor device. The module includes an outer frame, a set of optical elements, and an opaque coating. The outer frame includes an enclosing wall and a first opening surrounded by the enclosing wall. The set of optical elements connects to and is disposed in the enclosing wall. The opaque coating overlies the enclosing wall.
Public/Granted literature
- US20100085473A1 ENCAPSULANT MODULE WITH OPAQUE COATING Public/Granted day:2010-04-08
Information query
