Invention Grant
- Patent Title: Stencil foil assembly
- Patent Title (中): 模板箔组件
-
Application No.: US14569435Application Date: 2014-12-12
-
Publication No.: US09351406B2Publication Date: 2016-05-24
- Inventor: Thomas G. Erdmann
- Applicant: QTS Engineering, Inc.
- Applicant Address: US MA Medway
- Assignee: QTS ENGINEERING, INC.
- Current Assignee: QTS ENGINEERING, INC.
- Current Assignee Address: US MA Medway
- Agency: Barlow, Josephs & Holmes, Ltd.
- Main IPC: B41F15/36
- IPC: B41F15/36 ; H05K3/12 ; B41L13/02

Abstract:
A stencil assembly includes a stencil foil, having a stencil pattern thereon and of a planar configuration, with a peripheral edge, which is a captured by rigid frame. The rigid frame includes a base and a cover attached thereto. The assembly adapts a standard stencil foil for use in a stretch frame that requires an elongated groove. The assembly thereby facilitates mounting the stencil to a stretching machine during printing. Also, the stencil assembly protects a user from injury by preventing contact with the sharp outer edges of the stencil foil. Further, the assembly protects the stencil foil portion from damage and greatly facilitates handling thereof.
Public/Granted literature
- US20150165757A1 STENCIL FOIL ASSEMBLY Public/Granted day:2015-06-18
Information query