Systems and methods for processing potentially defective individual packaged modules are presented. A Printed Circuit Board (PCB) that includes a set of individual module substrates can be received and an image of a first side of the PCB can be captured by an image capture module which can include one or more cameras. Based on the captured image, it can be determined whether the set of individual module substrates includes previously identified (e.g., inked) individual module substrates that correspond to potentially defective individual module substrates. In response to determining that the set of individual module substrates includes inked individual module substrates, a map of the inked individual module substrates can be created. Based on the map, locations corresponding to the inked individual module substrates can be marked with a laser on a second side of the PCB.