A method in accordance with an embodiment comprises forming a feature on a substrate, disposing a first conductive pattern on the substrate and the feature, disposing a permeability material within the feature, disposing a substrate material on the substrate and the feature to facilitate substantial enclosure of the permeability material between the substrate and the substrate material, and disposing a second conductive pattern on the substrate material. The first conductive pattern and the second conductive pattern define at least one electrical circuit operable for coupling to a current source so as to cooperate to be capable of facilitating a magnetic field about the permeability material.