Invention Grant
- Patent Title: Adhesive transfer
- Patent Title (中): 粘合剂转移
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Application No.: US14117773Application Date: 2011-07-28
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Publication No.: US09355834B2Publication Date: 2016-05-31
- Inventor: Chien-Hua Chen , Michael G. Groh
- Applicant: Chien-Hua Chen , Michael G. Groh
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: Rathe Lindenbaum LLP
- International Application: PCT/US2011/045692 WO 20110728
- International Announcement: WO2013/015814 WO 20130131
- Main IPC: G09F3/10
- IPC: G09F3/10 ; B32B37/02 ; H01L21/02 ; H01L23/00 ; H01L25/065 ; H01L41/313
Abstract:
An adhesive transfer method includes depositing an adhesive on a first substrate, transferring a layer of the adhesive from the first substrate to an intermediate substrate, and transferring adhesive from the layer of the adhesive to at least one area of a second substrate.
Public/Granted literature
- US20140106142A1 ADHESIVE TRANSFER Public/Granted day:2014-04-17
Information query
