A technique for forming an integrated circuit die that contains an integrated sensor is provided. The integrated circuit die may be configured such that the sensor is exposed to ambient environmental conditions such that the sensor may detect ambient conditions. The integrated circuit die may be generally protected from environmental exposure by a mold resin. The mold resin may be formed in areas outside of a sensor region. Resin bleed from the mold resin into the sensor region may be prevented by the use of a resin dam that extends from the surface of the integrated circuit die. The resin dam may surround the sensor region.