Invention Grant
- Patent Title: Substrate treatment apparatus and substrate treatment method
- Patent Title (中): 基板处理装置及基板处理方法
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Application No.: US13427452Application Date: 2012-03-22
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Publication No.: US09355872B2Publication Date: 2016-05-31
- Inventor: Takayoshi Tanaka , Mai Yamakawa , Takahiro Yamaguchi
- Applicant: Takayoshi Tanaka , Mai Yamakawa , Takahiro Yamaguchi
- Applicant Address: JP
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2011-070495 20110328; JP2012-027423 20120210
- Main IPC: B08B3/04
- IPC: B08B3/04 ; B08B7/00 ; H01L21/67 ; H01L21/02

Abstract:
A substrate treatment apparatus includes: a substrate holding unit which horizontally holds a substrate; a liquid droplet nozzle which generates droplets of a treatment liquid which are sprayed on a spouting region on an upper surface of the substrate held by the substrate holding unit; and a protective liquid nozzle which spouts a protective liquid obliquely onto the upper surface of the substrate held by the substrate holding unit for protection of the substrate to cause the protective liquid to flow toward the spouting region on the upper surface of the substrate, whereby the spouting region is covered with a film of the protective liquid and, in this state, the treatment liquid droplets are caused to impinge on the spouting region.
Public/Granted literature
- US20120247506A1 SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD Public/Granted day:2012-10-04
Information query
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