Invention Grant
US09355876B2 Process load lock apparatus, lift assemblies, electronic device processing systems, and methods of processing substrates in load lock locations
有权
过程负载锁定装置，电梯组件，电子设备处理系统以及在负载锁定位置处理衬底的方法
- Patent Title: Process load lock apparatus, lift assemblies, electronic device processing systems, and methods of processing substrates in load lock locations
- Patent Title (中): 过程负载锁定装置，电梯组件，电子设备处理系统以及在负载锁定位置处理衬底的方法
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Application No.: US14203098Application Date: 2014-03-10
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Publication No.: US09355876B2Publication Date: 2016-05-31
- Inventor: Paul B. Reuter , Ganesh Balasubramanian , JuanCarlos Rocha-Alvarez , Jeffrey B. Robinson , Dale Robert du Bois , Paul Connors
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Dugan & Dugan, PC
- Main IPC: B23Q3/16
- IPC: B23Q3/16 ; H01L21/67
Abstract:
A process load lock apparatus is disclosed. The process load lock apparatus includes a load lock chamber adapted to couple between a mainframe section and a factory interface, the load lock chamber including an entry and an exit each having a slit valve, and a load lock process chamber located at a different level than the load lock chamber at the load lock location wherein the load lock process chamber is adapted to carry out a process on a substrate, such as oxide removal or other processes. Systems including the process load lock apparatus and methods of operating the process load lock apparatus are provided. A lift assembly including a containment ring is also disclosed, as are numerous other aspects.
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