Invention Grant
- Patent Title: Semiconductor device
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Application No.: US13596322Application Date: 2012-08-28
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Publication No.: US09355981B2Publication Date: 2016-05-31
- Inventor: Min Jae Lee , You Shin Chung , Hoon Jung
- Applicant: Min Jae Lee , You Shin Chung , Hoon Jung
- Assignee: AMKOR TECHNOLOGY, INC.
- Current Assignee: AMKOR TECHNOLOGY, INC.
- Agency: McAndrews, Held & Malloy, Ltd.
- Priority: KR10-2011-0078583 20110808
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/00 ; H05K3/34 ; H05K3/30 ; H01L23/498

Abstract:
Provided is a semiconductor device in which misalignment between a semiconductor die and a substrate (e.g., a circuit board) can be prevented or substantially reduced when the semiconductor die is attached to the circuit board. In a non-limiting example, the semiconductor device includes: a semiconductor die comprising at least one bump; and a circuit board comprising at least one circuit pattern to which the bump is electrically connected. In a non-limiting example, the circuit board comprises: an insulation layer comprising a center region and peripheral regions around the center region; a plurality of center circuit patterns formed in the center region of the insulation layer; and a plurality of peripheral circuit patterns formed in the peripheral regions of the insulation layer. The center circuit patterns may be formed wider than the peripheral circuit patterns, formed in a zigzag pattern, and/or may be formed in a crossed shape.
Public/Granted literature
- US20130037945A1 SEMICONDUCTOR DEVICE Public/Granted day:2013-02-14
Information query
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