A semiconductor integrated circuit may include a plurality of semiconductor chips configured to be stacked in three dimensions, a first group of through-chip vias configured to go through the plurality of semiconductor chips, respectively, and to be used for density extension of the semiconductor integrated circuit, and a second group of through-chip vias configured to go through the plurality of semiconductor chips, respectively, and to be used for a bandwidth extension of the semiconductor integrated circuit. Each of the plurality of semiconductor chips includes a path selection unit configured to select one of the first group of through-chip vias arranged in the semiconductor chip or one of the second group of through-chip vias arranged in the semiconductor chip in response to a mode switching signal, and an internal circuit configured to be selectively coupled to a through-chip via selected by the path selection unit.