Invention Grant
- Patent Title: Solid state imaging device and manufacturing method, and electronic apparatus
- Patent Title (中): 固态成像装置及其制造方法以及电子装置
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Application No.: US14204847Application Date: 2014-03-11
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Publication No.: US09356064B2Publication Date: 2016-05-31
- Inventor: Hiroaki Seko
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JP2013-054588 20130318
- Main IPC: H01L27/146
- IPC: H01L27/146
Abstract:
A solid state imaging device includes a substrate, in which the substrate includes a photoelectric conversion unit that generates a charge according to a light amount of incident light by a pixel unit, an accumulation unit that divides the charge of the pixel unit which is generated in the photoelectric conversion unit and accumulates the charge, a first element isolation unit that is formed at a boundary of the photoelectric conversion unit of the pixel unit, and a second element isolation unit that is formed at a boundary of the accumulation unit of a divided unit of the pixel.
Public/Granted literature
- US20140264694A1 SOLID STATE IMAGING DEVICE AND MANUFACTURING METHOD, AND ELECTRONIC APPARATUS Public/Granted day:2014-09-18
Information query
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