Invention Grant
- Patent Title: Light-emitting device and method for manufacturing the same
- Patent Title (中): 发光装置及其制造方法
-
Application No.: US14223495Application Date: 2014-03-24
-
Publication No.: US09356189B2Publication Date: 2016-05-31
- Inventor: Jar-Yu Wu , Yu-Ming Kun , Chun-Lung Tseng
- Applicant: Epistar Corporation
- Applicant Address: TW Hsinchu
- Assignee: EPISTAR CORPORATION
- Current Assignee: EPISTAR CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/00 ; H01L27/15 ; H01L33/38
Abstract:
A method for manufacturing a light-emitting device comprising the steps of: providing a substrate; forming a semiconductor epitaxial stack on the substrate; and forming multiple isolation trenches in the semiconductor epitaxial stack by using a laser beam irradiating the semiconductor epitaxial stack to define multiple light-emitting diode units wherein partial of the substrate is exposed by the isolation trenches.
Public/Granted literature
- US20150270432A1 LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2015-09-24
Information query
IPC分类:
