Invention Grant
- Patent Title: Liquid ejecting head and liquid ejecting apparatus
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Application No.: US14067830Application Date: 2013-10-30
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Publication No.: US09356223B2Publication Date: 2016-05-31
- Inventor: Takayuki Yonemura , Masahisa Nawano
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JP2010-056803 20100312
- Main IPC: B41J2/045
- IPC: B41J2/045 ; H01L41/053 ; B41J2/14 ; B41J2/16 ; H01L41/08 ; H01L41/09 ; H01L41/187 ; H01L41/318

Abstract:
A liquid ejecting head includes a plate which is composed of a material containing silicon, a titanium oxide layer which is disposed above the plate, a bismuth-containing layer which is disposed above the titanium oxide layer and contains bismuth, a first electrode which is disposed above the bismuth-containing layer and composed of platinum, a piezoelectric layer which is disposed above the first electrode and composed of a piezoelectric material containing at least bismuth, and a second electrode which is disposed above the piezoelectric layer.
Public/Granted literature
- US20140055531A1 LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS Public/Granted day:2014-02-27
Information query
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