Invention Grant
- Patent Title: Utilization of antenna loading for impedance matching
- Patent Title (中): 利用天线负载进行阻抗匹配
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Application No.: US13745609Application Date: 2013-01-18
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Publication No.: US09356343B2Publication Date: 2016-05-31
- Inventor: Alireza Mahanfar , Javier Rodriguez De Luis , Stanley Yu Tao Ng , Benjamin J. Shewan , Kim Willi Schulze
- Applicant: Microsoft Technology Licensing, LLC
- Applicant Address: US WA Redmond
- Assignee: Microsoft Technology Licensing, LLC
- Current Assignee: Microsoft Technology Licensing, LLC
- Current Assignee Address: US WA Redmond
- Agent Judy Yee; Micky Minhas
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H01Q21/00 ; H01Q1/50

Abstract:
Techniques for utilization of antenna loading for impedance matching are described. In at least some embodiments, a device (e.g., a smart phone) includes multiple antennas that are employed to send and receive wireless signals for the device. The device further includes impedance matching functionality communicatively connected to the antennas, and configured to perform impedance matching for one of the antennas based on loading (e.g., dielectric loading) of another of the antennas.
Public/Granted literature
- US20140203980A1 Utilization of Antenna Loading for Impedance Matching Public/Granted day:2014-07-24
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