Invention Grant
- Patent Title: Temperature insensitive external cavity lasers on silicon
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Application No.: US14682167Application Date: 2015-04-09
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Publication No.: US09356419B1Publication Date: 2016-05-31
- Inventor: Jason S. Orcutt
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Canton Colburn LLP
- Agent Vazken Alexanian
- Main IPC: H01S3/10
- IPC: H01S3/10 ; H01S5/343 ; H01S5/30 ; H01S5/028

Abstract:
A technique related to a semiconductor chip is provided. An optical gain chip is attached to a semiconductor substrate. An integrated photonic circuit is on the semiconductor substrate, and the optical gain chip is optically coupled to the integrated photonic circuit thereby forming a laser cavity. The integrated photonic circuit includes an active intra-cavity thermo-optic optical phase tuner element, an intra-cavity optical band-pass filter, and an output coupler band-reflect optical grating filter with passive phase compensation. The active intra-cavity thermo-optic optical phase tuner element, the intra-cavity optical band-pass filter, and the output coupler band-reflect optical grating filter with passive phase compensation are optically coupled together.
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