Invention Grant
- Patent Title: Molded package and light emitting device
- Patent Title (中): 成型包装和发光装置
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Application No.: US13744586Application Date: 2013-01-18
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Publication No.: US09357641B2Publication Date: 2016-05-31
- Inventor: Shimpei Sasaoka , Takuya Nakabayashi
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Mori & Ward, LLP
- Priority: JP2012-010449 20120120
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L21/00 ; H05K1/03 ; H01L33/38 ; H01L33/48 ; H01L33/62
Abstract:
A molded package includes a molded resin and a lead. The molded resin has a recess portion provided on an upper surface of the molded resin to accommodate a light emitting component. The lead is partially exposed from a bottom surface of the recess portion of the molded resin to be electrically connected to the light emitting component and extends below a side wall of the recess portion. The lead has a groove formed on a surface of the lead at least partially along the side wall. The groove has an inside upper edge and an outside upper edge and is filled with the molded resin so that the inside upper edge is exposed from the bottom surface of the recess portion and the outside upper edge is embedded within the molded resin.
Public/Granted literature
- US20130187188A1 MOLDED PACKAGE AND LIGHT EMITTING DEVICE Public/Granted day:2013-07-25
Information query
IPC分类:
