Invention Grant
- Patent Title: Hermetically sealed prosthetic component and method therefor
- Patent Title (中): 密封假体组件及其方法
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Application No.: US14140857Application Date: 2013-12-26
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Publication No.: US09357964B2Publication Date: 2016-06-07
- Inventor: Marc Stein , Andrew Chase
- Applicant: Orthosensor Inc
- Applicant Address: US FL Dania Beach
- Assignee: ORTHOSENSOR INC.
- Current Assignee: ORTHOSENSOR INC.
- Current Assignee Address: US FL Dania Beach
- Main IPC: A61B5/103
- IPC: A61B5/103 ; A61B5/22 ; A61B5/00 ; A61B5/01 ; A61F2/38

Abstract:
A prosthetic component suitable for long-term implantation is provided. The prosthetic component measures a parameter of the muscular-skeletal system is disclosed. The prosthetic component comprises a first structure having at least one support surface, a second structure having at least one feature configured to couple to bone, and at least one sensor. The electronic circuitry and sensors are hermetically sealed within the prosthetic component. The sensor couples to the support surface of the first structure. The first and second structure are coupled together housing the at least one sensor. In one embodiment, the first and second structure are welded together forming the hermetic seal that isolates the at least one sensor from an external environment. The at least one sensor can be a pressure sensor for measuring load and position of load.
Public/Granted literature
- US20140107796A1 Hermetically Sealed Prosthetic Component and Method Therefor Public/Granted day:2014-04-17
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