Invention Grant
- Patent Title: Substrate treating apparatus
- Patent Title (中): 底物处理装置
-
Application No.: US13785673Application Date: 2013-03-05
-
Publication No.: US09358587B2Publication Date: 2016-06-07
- Inventor: Yukio Tomifuji , Shigeki Minami , Kazuo Jodai , Norio Yoshikawa
- Applicant: DAINIPPON SCREEN MFG. CO., LTD.
- Applicant Address: JP
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2012-075690 20120329
- Main IPC: H01L21/02
- IPC: H01L21/02 ; B08B3/02 ; H05K3/00

Abstract:
A substrate treating apparatus includes a loading section 1, a treating tank 2, a rinsing tank 4, a drying tank 5, an unloading section 6, and a pair of endless belt members 7 for transporting substrates successively through the loading section 1, treating tank 2, rinsing tank 4, drying tank 5 and unloading section 6. The substrate treating apparatus further includes a fixing mechanism for fixing a pair of side edges of each substrate parallel to a transport direction of the substrate to the endless belt members 7. In the loading section 1, a plurality of substrates are fixed, each with the pair of edges thereof parallel to the transport direction fixed at constant intervals to the pair of endless belt members 7. The substrates having undergone the treatment are removed from the pair of endless belt members 7 in the unloading section 6.
Public/Granted literature
- US20130255732A1 SUBSTRATE TREATING APPARATUS Public/Granted day:2013-10-03
Information query
IPC分类: