Invention Grant
- Patent Title: Supporting plate for a laser sintering device and enhanced sintering method
- Patent Title (中): 激光烧结装置支撑板和增强烧结方法
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Application No.: US13505112Application Date: 2010-10-29
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Publication No.: US09358611B2Publication Date: 2016-06-07
- Inventor: Daniel Bonnet , Arkadiusz Waszkiewicz
- Applicant: Daniel Bonnet , Arkadiusz Waszkiewicz
- Applicant Address: FR Clermont-Ferrand CH Granges-Paccot
- Assignee: COMPAGNIE GENERAL DES ETABLISSEMENTS MICHELIN,MICHELIN RECHERCHE ET TECHNIQUE S.A.
- Current Assignee: COMPAGNIE GENERAL DES ETABLISSEMENTS MICHELIN,MICHELIN RECHERCHE ET TECHNIQUE S.A.
- Current Assignee Address: FR Clermont-Ferrand CH Granges-Paccot
- Agency: Dickinson Wright PLLC
- Priority: FR0957765 20091103
- International Application: PCT/EP2010/066536 WO 20101029
- International Announcement: WO2011/054772 WO 20110512
- Main IPC: B22F7/08
- IPC: B22F7/08 ; B22F3/105 ; B22F5/00 ; B29C67/00
Abstract:
Sintering device comprising a laser source, the light power of which is capable of selectively melting successive layers of metal powders, and a reference plate on which the first metal powder layer is deposited and which serves as a base for the construction of an object, characterized in that the said plate comprises one or more recesses, the shape of which is determined so as to make the said recesses capable of receiving inserts of a given shape.
Public/Granted literature
- US20120260492A1 SUPPORTING PLATE FOR A LASER SINTERING DEVICE AND ENHANCED SINTERING METHOD Public/Granted day:2012-10-18
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