Invention Grant
- Patent Title: Laser machining device
- Patent Title (中): 激光加工装置
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Application No.: US14257003Application Date: 2014-04-21
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Publication No.: US09358641B2Publication Date: 2016-06-07
- Inventor: Chen-Han Lin
- Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
- Applicant Address: TW New Taipei
- Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: TW102115125A 20130426
- Main IPC: B23K26/02
- IPC: B23K26/02 ; B23K26/08 ; B23K26/38 ; B23K26/04

Abstract:
A laser machining device with a proximity-warning function in relation to a workpiece being machined includes a laser element and a position feedback unit. The laser element includes a laser head for emitting a focused laser beam and a movable member for moving the laser head. The position feedback unit is positioned on the movable member and connected to an alerting circuit. When an elastic contacting member in the position feedback unit is compressed because the distance between the laser head and the workpiece is less than a minimum permitted distance the alerting circuit issues an alert.
Public/Granted literature
- US20140319109A1 LASER MACHINING DEVICE Public/Granted day:2014-10-30
Information query
IPC分类: