Invention Grant
- Patent Title: Slurry supply device and polishing apparatus including the same
- Patent Title (中): 浆料供给装置和包括其的研磨装置
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Application No.: US14571492Application Date: 2014-12-16
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Publication No.: US09358666B2Publication Date: 2016-06-07
- Inventor: Jae Hyun Bae , Kee Yun Han
- Applicant: LG SILTRON INCORPORATED
- Applicant Address: KR Gumi-Si
- Assignee: LG SILTRON INCORPORATED
- Current Assignee: LG SILTRON INCORPORATED
- Current Assignee Address: KR Gumi-Si
- Agency: KED & Associates, LLP
- Priority: KR10-2014-0105105 20140813
- Main IPC: B24B57/00
- IPC: B24B57/00 ; B24B57/02 ; B24B53/017

Abstract:
Disclosed is a slurry supply device including a nozzle configured to eject slurry, a slurry supply unit configured to receive the slurry from the nozzle and to discharge the slurry through at least one slurry hole, a receiving unit configured to allow the slurry supply unit to be mounted, inserted, seated, coupled, supported, or placed therein so as to enable discharge of the slurry from the slurry supply unit, the receiving unit being configured to receive a flowing material around the slurry supply unit and a slurry protection unit configured to enclose a space for passage of the slurry from an exit of the nozzle to an entrance of the slurry supply unit in conjunction with the flowing material.
Public/Granted literature
- US20160045999A1 SLURRY SUPPLY DEVICE AND POLISHING APPARATUS INCLUDING THE SAME Public/Granted day:2016-02-18
Information query