Invention Grant
- Patent Title: Temperature management of aluminium nitride electrostatic chuck
- Patent Title (中): 氮化铝静电吸盘的温度管理
-
Application No.: US14139116Application Date: 2013-12-23
-
Publication No.: US09358702B2Publication Date: 2016-06-07
- Inventor: Sumanth Banda , Jennifer Y. Sun , Douglas A Buchberger, Jr. , Shane C. Nevil
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lowenstein Sandler LLP
- Main IPC: B23Q3/06
- IPC: B23Q3/06 ; B28D5/00 ; H01L21/67 ; H01L21/683 ; H01L21/687
Abstract:
An unseasoned substrate support assembly includes a ceramic body and a thermally conductive base bonded to a lower surface of the ceramic body. The substrate support assembly further includes an upper surface of the ceramic body having a first portion proximate to a center of the upper surface of the ceramic body and having a first roughness profile and a second portion distal from the center of the upper surface of the ceramic body and having a second roughness profile with a lower roughness than the first roughness profile, wherein areas of the first and second portions are based on radial distances from the center of the ceramic body.
Public/Granted literature
- US20140203526A1 TEMPERATURE MANAGEMENT OF ALUMINIUM NITRIDE ELECTROSTATIC CHUCK Public/Granted day:2014-07-24
Information query
IPC分类:
