Invention Grant
US09358763B2 Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatus
有权
半导体刚性基板层压板和半透明刚性基板接合装置的制造方法
- Patent Title: Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatus
- Patent Title (中): 半导体刚性基板层压板和半透明刚性基板接合装置的制造方法
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Application No.: US14233025Application Date: 2012-07-13
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Publication No.: US09358763B2Publication Date: 2016-06-07
- Inventor: Hiroyuki Kurimura
- Applicant: Hiroyuki Kurimura
- Applicant Address: JP Tokyo
- Assignee: DENKA COMPANY LIMITED
- Current Assignee: DENKA COMPANY LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Stein IP, LLC
- Priority: JP2011-156198 20110715
- International Application: PCT/JP2012/068020 WO 20120713
- International Announcement: WO2013/011969 WO 20130124
- Main IPC: B32B37/12
- IPC: B32B37/12 ; B32B37/14 ; B32B7/12 ; C09D4/00 ; B32B37/00 ; C09J5/00 ; C09D133/06 ; C09D133/14 ; B32B7/06 ; B32B17/10 ; C08F220/18 ; C08F222/10 ; B32B38/00

Abstract:
Provided is a method of manufacturing a translucent rigid substrate laminate, which method can improve position precision while increasing production efficiency. Further provided is a translucent rigid substrate bonding apparatus that contributes to improvement of the position precision while increasing production efficiency of a plate-shaped product. In the method of manufacturing a translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent including (A) polyfunctional (meth)acrylate, (B) monofunctional (meth)acrylate and (C) a photopolymerization initiator therebetween, only the fixing agent present in outer peripheral portions of both translucent rigid substrates is cured for provisional fastening.
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