Invention Grant
US09358763B2 Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatus 有权
半导体刚性基板层压板和半透明刚性基板接合装置的制造方法

Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatus
Abstract:
Provided is a method of manufacturing a translucent rigid substrate laminate, which method can improve position precision while increasing production efficiency. Further provided is a translucent rigid substrate bonding apparatus that contributes to improvement of the position precision while increasing production efficiency of a plate-shaped product. In the method of manufacturing a translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent including (A) polyfunctional (meth)acrylate, (B) monofunctional (meth)acrylate and (C) a photopolymerization initiator therebetween, only the fixing agent present in outer peripheral portions of both translucent rigid substrates is cured for provisional fastening.
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