Invention Grant
- Patent Title: Fluid ejection device and method of forming same
- Patent Title (中): 流体喷射装置及其形成方法
-
Application No.: US13457910Application Date: 2012-04-27
-
Publication No.: US09358783B2Publication Date: 2016-06-07
- Inventor: Vincent C Korthuis
- Applicant: Vincent C Korthuis
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16

Abstract:
A method of forming a fluid ejection device includes providing a substrate having a first side supporting an oxide layer and a conductive layer over the oxide layer; and patterning the conductive layer to define an area for an actuator of the fluid ejection device, including shaping the area with first and second ends each having a first width and at least one portion between the first and second ends having a second width less than the first width.
Public/Granted literature
- US20130286083A1 FLUID EJECTION DEVICE AND METHOD OF FORMING SAME Public/Granted day:2013-10-31
Information query
IPC分类: