Invention Grant
- Patent Title: Liquid ejecting head, liquid ejecting apparatus, and method for manufacturing liquid ejecting head
- Patent Title (中): 液体喷射头,液体喷射装置和液体喷射头的制造方法
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Application No.: US14678317Application Date: 2015-04-03
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Publication No.: US09358784B2Publication Date: 2016-06-07
- Inventor: Kazufumi Oya
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2014-077581 20140404
- Main IPC: B41J2/045
- IPC: B41J2/045 ; B41J2/14 ; B41J2/16

Abstract:
A liquid ejecting head includes a nozzle opening that is formed on one face of a silicon substrate, and ejects liquid, a first concave portion that is provided on the other face of the silicon substrate, and configures a pressure generating chamber which communicates with the nozzle opening, and a second concave portion that is provided on one face of the silicon substrate, and configures a flow path which communicates with the first concave portion and supplies the liquid, in which the first concave portion and the second concave portion overlap each other in an in-plane direction when seen in a direction which is orthogonal to the face of the silicon substrate.
Public/Granted literature
- US20150283813A1 LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND METHOD FOR MANUFACTURING LIQUID EJECTING HEAD Public/Granted day:2015-10-08
Information query
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