Invention Grant
- Patent Title: Print head die
- Patent Title (中): 打印头模具
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Application No.: US14861635Application Date: 2015-09-22
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Publication No.: US09358788B2Publication Date: 2016-06-07
- Inventor: Mark H. MacKenzie , Matthew A. Shepherd , Wesley R. Schalk
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc. Patent Department
- Main IPC: B41J2/15
- IPC: B41J2/15 ; B41J2/145 ; B41J2/14

Abstract:
Various configurations of print head die are described. In an example, a first print head die has first print structures disposed along a major dimension thereof perpendicular to the media path, the first print structures including a leading print structure with respect to the media path. A second print head die independent of the first print head die has second print structures disposed along a major dimension thereof perpendicular to the media path, the second print head die being staggered with respect to the first print head die along the media path, the second print structures including a leading print structure with respect to the media path. An extent between respective leading print structures of the first and second print head dies is between a minimum equal to a width of the first print head plus 100 μm and a maximum value such that the distance along the media path between any of the first print structures and any of the second print structures does not exceed 10 mm.
Public/Granted literature
- US20160009083A1 PRINT HEAD DIE Public/Granted day:2016-01-14
Information query
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